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SiO2
Associates was incubated
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A tour of the Combined
Ion and Molecular Deposition Laboratory (CIMD Lab) of Prof. Nicole
Herbots and SiO2 Associates.
First, an overview:
Where and what is the CIMD lab?
The CIMD laboratory is dedicated to the synthesis of new
materials and occupies a 400 square feet clean-room of class 100,
located inside the IBeAM
Facility of the basement of the Goldwater Center at ASU. This feature
provides the CIMD lab with next door access to analysis for the new
materials developed and grown in the CIMD lab.
The IBeAM Facility houses a 1.7 MeV Tandem ion
accelerator for RBS/Ion Channeling used extensively to characterize the
composition and structure of the thin films and interfaces grown in the
clean room.
Class 100 means than less than 100 particulates
larger than 0.3 microns fall per cubic feet per minute in the room. The containment outfits worn by the
researchers shown in the lab, and all the surface materials in the
clean-room are all selected to minimize particulate shedding. The
CIMD laboratory contains several class 10 laminar flow hoods for sample
preparation and storage, and used as workbenches for ultra-high-vacuum
components, which are discussed and shown in pictures here below.
What is it for? Nicole
Herbots and her group of students research low temperature methods of
synthesis and processing of new semiconductor thin films such as SiGeO2,
epitaxial silicon dioxides, SiGe, SiGeC, SiGeC oxides, and GaAs Oxides. The synthesis methods used include CIMD (US Patent 4,800,200, N. Herbots
et al) which combines molecular beams, ion beam deposition, and IBO (Ion
Beam Oxidation), and new low temperature surface processing techniques
to produce templates for epitaxy.
THE PICTURE:
The view shows the ultra-high-vacuum chamber used for CIMD deposition on
the right, with a graduate student in Physics, Joan Xiang , seated and
examining the carbon deposition source through a small window Kurt
Daley, a graduate student in Science and Engineering of Materials stands
next to the small loadlock chamber of the CIMD system. He holds a 4
inch silicon wafer that he poised to insert into the loadlock. The
orange transfer rod on the left enables the transfer of the wafer from
the loadlock to the vacuum system. |
A
close-up of the CIMD deposition chamber.
A smaller, intermediate vacuum chamber is attached
on the left hand side, and acts as a buffer between the loadlock where
wafers are loaded from atmosphere and the deposition CIMD deposition
chamber whose base pressure is 5 x 10-10
Torr.
The larger, cylindrical vacuum chamber houses
deposition hardware for various materials, such as Si and Ge (on
the largest side flange on the right).
It also supports different oil-free vacuum pumps
to maintain the base pressure, such as cryopumps, ion pumps and
sublimation pumps (one of the cryopumps
can be partially seen on the far right)
Several monitoring devices control the species
and the rate of deposition via a feedback loop connected to the
deposition hardware. They include a quartz monitor, Electron Induced
Electroluminescence Spectroscopy (EIES) sensors
(above the large source flange),
ion gauges (not seen), and
Reflective High Energy Electron Diffraction (RHEED). The camera used to capture RHEED
diffraction patterns is seen on the far right just above the cryopump. |
What is
inside the CIMD deposition chamber?
Many items,
for
example:
Key elements of the CIMD system are commercial
electron beam evaporators (called e-guns) used to produce the molecular
beams.
Shown here at left are the Si and Ge electron
beam evaporation units pulled out of the chamber for much needed
maintenance. Debris of previous deposition can be seen littering the
copper blocks forming the e-guns.
The copper blocks, which are water-cooled during
operation, each contain a 40 cc hearth where the either Si and Ge solid
charges are inserted. The Si e-gun on the left is almost empty. The Ge
e-gun on the left has Ge material recessed in the earth.
The electrical connections isolated by a string
of cylindrical ceramic beads are seen on the right hand side. |
The
electron beam evaporation units inside their shroud.
After careful cleaning and loading of new Si and Ge
material, the e-guns are ready to be inserted back into the system. The
shroud is a double-walled stainless steel "box" which can be cooled with
water or liquid nitrogen. Shutters are seen above the holes in the
shroud giving access to the molecular hearths allow for the formation of
alternating layers. The hole in the shutter allows sampling of the
molecular beam by the sensors while the shutter is shut. The
evaporation rate can thus be adjusted prior for the deposition to
commence. |
The
chemical laminar flow hood in the clean room.
Many of the specialized research apparatus was
designed and built by Prof. Herbots and her students with the Physics
Department machine shop.
Murdock
Hart, undergraduate research assistant with Prof. Herbots, executes an
experimental sequence synthesizing Langmuir-Blodgett molecular films for
Si(100) wafer bonding with oxidized Si for the purpose of integrating
blood chemistry monitors with medical electronic processors. |
The
controlled atmosphere glovebox. |
The
controlled atmosphere loadlock.
A smaller controlled atmosphere loadlock, limits
the introduction of atmospheric contaminants when loading wafers in the
vacuum loadlock below. |
A
prototype of another ion beam oxidation system for the CIMD lab coming
out of the machine shop. |
The
sample transfer rod for silicon wafers in use. |
A
polished Si(100) wafer showing a mirror finish and the absence of
particulates expected in a class 1 hood . This surface exhibits at the
microscopic level atomic terraces about 20 nm (200 Å) wide instead of
the typical 0.2 nm (2 Å) commonly found in electronic grade and
commercial Si(100) wafers used for research. This exteremely planarized
surface topography is obtained via our US Patent 6,613,677 (9/2/2003)
(Photo Credit: François Thilmany, high school senior, from the Institut
Saint-André, Ixelles, Belgium, 8/15/08-9/26/08). |
New improved hood
design with processing capability of 1" - 16" wafers. |
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